naa a22 4500 510804306 CHVBK 20180411083409.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2612-1 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2612-1 Phase-Field Modeling and Experimental Observation of Microstructures in Solidifying Sn-Ag-Cu Solders [Elektronische Daten] [G.J. Schmitz, B. Zhou, B. Böttger, S. Klima, J. Villain] A multiphase-field model coupled to a thermodynamic database has been successfully applied to model the microstructure evolution during solidification of ternary Sn-Ag-Cu solders, revealing up to five different phases. Simulations were performed in two dimensions (2D) in the bulk volume of the solder as well as at the interface with a copper substrate, addressing the length scales of both dendritic and eutectic structures. Primary dendrite spacing and secondary arm spacing of Sn dendrites in the bulk solder volume match well with experimental observations. The eutectic spacing of Ag3Sn lamellae and their thickness also match experimental data, while the thickness of the Cu6Sn5 lamellae is slightly larger than found by experiment. Nucleation and growth of Cu6Sn5 on a Cu substrate lead to superficial dissolution and roughening of the substrate, with the size of the Cu6Sn5 largely determined by its nucleation conditions. TMS, 2013 Multiphase-field model nationallicence thermodynamic databases nationallicence nucleation nationallicence intermetallics nationallicence substrate reaction nationallicence scallop formation nationallicence Schmitz G.J. Access e.V. RWTH Aachen, Intzestr. 5, 52072, Aachen, Germany aut Zhou B. Access e.V. RWTH Aachen, Intzestr. 5, 52072, Aachen, Germany aut Böttger B. Access e.V. RWTH Aachen, Intzestr. 5, 52072, Aachen, Germany aut Klima S. University of Applied Sciences, Augsburg, Germany aut Villain J. University of Applied Sciences, Augsburg, Germany aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2658-2666 0361-5235 42:8<2658 2013 42 11664 https://doi.org/10.1007/s11664-013-2612-1 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2612-1 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Schmitz G.J. Access e.V. RWTH Aachen, Intzestr. 5, 52072, Aachen, Germany aut NATIONALLICENCE 700 1- Zhou B. Access e.V. RWTH Aachen, Intzestr. 5, 52072, Aachen, Germany aut NATIONALLICENCE 700 1- Böttger B. Access e.V. RWTH Aachen, Intzestr. 5, 52072, Aachen, Germany aut NATIONALLICENCE 700 1- Klima S. University of Applied Sciences, Augsburg, Germany aut NATIONALLICENCE 700 1- Villain J. University of Applied Sciences, Augsburg, Germany aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2658-2666 0361-5235 42:8<2658 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer