naa a22 4500 510804357 CHVBK 20180411083409.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2610-3 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2610-3 Ultrafast UV-Curable Adhesives for Optical Pick-Ups [Elektronische Daten] [Chang-Kyu Chung, Kyung-Woon Jang, Hyoung Choi, Jiyoung Jang, Youngjun Moon, Chulho Jeon] This paper describes novel ultraviolet (UV)-curable adhesives with an ultrafast curing rate which are fully cured within 8s for optical pick-up (OPU) applications. Two kinds of oligomers (novolac epoxy acrylate and urethane acrylate), additives, and inorganic fillers were prepared for the formulation of the adhesives. In addition, three kinds of photo-initiator [2,2-dimethoxy-2-phenylacetophenone and 2-hydroxy-2-methylpropiophenone for surface curing and (2,4,6-trimethylbenzoyl) diphenyl phosphine oxide (TMDPO) for deep curing] were mixed to increase the curing rate. Photo-differential scanning calorimetry (photo-DSC) analyses showed that the newly formulated UV adhesives had faster curing rate than conventional UV adhesives. The UV adhesives were applied to OPUs for DVD/CD-RW, and five kinds of reliability tests, i.e., thermal shock, low-temperature storage, high-temperature storage, high temperature/high humidity, and nonoperation shock tests, were conducted to evaluate the adhesive reliability. According to the results of reliability tests and thermal stress simulations, the UV adhesives with lower storage modulus (E′) showed better thermal shock reliability due to lower thermal stresses. In addition, OPUs assembled using the UV adhesives passed all reliability tests. Consequently, the UV adhesives were successfully applied to OPUs in OPU production lines, contributing to mass production. TMS, 2013 UV-curable adhesives nationallicence photo-initiator nationallicence optical pick-up nationallicence DVD/CD-RW nationallicence coefficient of thermal expansion nationallicence modulus nationallicence reliability nationallicence photodiode balance nationallicence Chung Chang-Kyu Advanced Interconnection & EMC Group, Global Production Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan 3-dong, Yeongtong-gu, 443-742, Suwon-si, Gyeonggi-do, South Korea aut Jang Kyung-Woon Advanced Interconnection & EMC Group, Global Production Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan 3-dong, Yeongtong-gu, 443-742, Suwon-si, Gyeonggi-do, South Korea aut Choi Hyoung DFx Group, Manufacturing Core Technology Team, Global Production Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan 3-dong, Yeongtong-gu, 443-742, Suwon-si, Gyeonggi-do, South Korea aut Jang Jiyoung Advanced Interconnection & EMC Group, Global Production Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan 3-dong, Yeongtong-gu, 443-742, Suwon-si, Gyeonggi-do, South Korea aut Moon Youngjun Advanced Interconnection & EMC Group, Global Production Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan 3-dong, Yeongtong-gu, 443-742, Suwon-si, Gyeonggi-do, South Korea aut Jeon Chulho Development 4 Group, Toshiba Samsung Storage Technology Korea Corporation, 486, Sin-dong, Yeongtong-gu, 443-734, Suwon-si, Gyeonggi-do, South Korea aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2525-2535 0361-5235 42:8<2525 2013 42 11664 https://doi.org/10.1007/s11664-013-2610-3 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2610-3 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Chung Chang-Kyu Advanced Interconnection & EMC Group, Global Production Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan 3-dong, Yeongtong-gu, 443-742, Suwon-si, Gyeonggi-do, South Korea aut NATIONALLICENCE 700 1- Jang Kyung-Woon Advanced Interconnection & EMC Group, Global Production Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan 3-dong, Yeongtong-gu, 443-742, Suwon-si, Gyeonggi-do, South Korea aut NATIONALLICENCE 700 1- Choi Hyoung DFx Group, Manufacturing Core Technology Team, Global Production Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan 3-dong, Yeongtong-gu, 443-742, Suwon-si, Gyeonggi-do, South Korea aut NATIONALLICENCE 700 1- Jang Jiyoung Advanced Interconnection & EMC Group, Global Production Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan 3-dong, Yeongtong-gu, 443-742, Suwon-si, Gyeonggi-do, South Korea aut NATIONALLICENCE 700 1- Moon Youngjun Advanced Interconnection & EMC Group, Global Production Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan 3-dong, Yeongtong-gu, 443-742, Suwon-si, Gyeonggi-do, South Korea aut NATIONALLICENCE 700 1- Jeon Chulho Development 4 Group, Toshiba Samsung Storage Technology Korea Corporation, 486, Sin-dong, Yeongtong-gu, 443-734, Suwon-si, Gyeonggi-do, South Korea aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2525-2535 0361-5235 42:8<2525 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer