naa a22 4500 510804365 CHVBK 20180411083410.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2609-9 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2609-9 Effect of Thickness and Phosphorus Content on Au/Pd/Ni(P) Metal Finish of Printed Circuit Board [Elektronische Daten] [Chih-Kai Huang, Keh-Wen Lin, Yu-Ming Huang, Alvin Caparanga, Rhoda Leron, Meng-Hui Li] Electroless nickel/electroless palladium/immersion gold [Au/Pd/Ni(P) or ENEPIG] pads consisting of layers of Ni(P) (200μin), pure palladium (Pd) or palladium phosphorus (PdP) (2μin, 4μin or 6μin), and gold (Au) (2μin or 4μin) were prepared using two different processes (wire bonding and lead-free soldering). Each of these processes was done with zero- or two-time reflow. Different tests on solderability, wettability, wire-bonding capacity, and corrosion resistance were performed on different combinations of ENEPIG pads formed using different combinations of processes and conditions. Scanning electron microscopy was also performed to examine the surface characteristics of the pads. It was found that the ENEPIG pad sample with the 4-μin-thick Au and 4-μin-thick PdP layers possessed stable wire-bonding capacity and excellent lead-free solder reliability. In addition, the ENEPIG-PdP systems showed better corrosion resistance, which is attributed to the presence of the amorphous PdP layer protecting the nickel layer. TMS, 2013 ENEPIG nationallicence PCB nationallicence corrosion nationallicence wire bonding nationallicence lead-free soldering nationallicence Huang Chih-Kai Department of Chemical Engineering and R&D Center for Membrane Technology, Chung Yuan Christian University, 32023, Chung Li City, Taiwan, ROC aut Lin Keh-Wen OMG (Asia) Electronics Company Limited, 32053, Chung Li City, Taiwan, ROC aut Huang Yu-Ming OMG (Asia) Electronics Company Limited, 32053, Chung Li City, Taiwan, ROC aut Caparanga Alvin Department of Chemical Engineering and R&D Center for Membrane Technology, Chung Yuan Christian University, 32023, Chung Li City, Taiwan, ROC aut Leron Rhoda Department of Chemical Engineering and R&D Center for Membrane Technology, Chung Yuan Christian University, 32023, Chung Li City, Taiwan, ROC aut Li Meng-Hui Department of Chemical Engineering and R&D Center for Membrane Technology, Chung Yuan Christian University, 32023, Chung Li City, Taiwan, ROC aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2648-2657 0361-5235 42:8<2648 2013 42 11664 https://doi.org/10.1007/s11664-013-2609-9 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2609-9 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Huang Chih-Kai Department of Chemical Engineering and R&D Center for Membrane Technology, Chung Yuan Christian University, 32023, Chung Li City, Taiwan, ROC aut NATIONALLICENCE 700 1- Lin Keh-Wen OMG (Asia) Electronics Company Limited, 32053, Chung Li City, Taiwan, ROC aut NATIONALLICENCE 700 1- Huang Yu-Ming OMG (Asia) Electronics Company Limited, 32053, Chung Li City, Taiwan, ROC aut NATIONALLICENCE 700 1- Caparanga Alvin Department of Chemical Engineering and R&D Center for Membrane Technology, Chung Yuan Christian University, 32023, Chung Li City, Taiwan, ROC aut NATIONALLICENCE 700 1- Leron Rhoda Department of Chemical Engineering and R&D Center for Membrane Technology, Chung Yuan Christian University, 32023, Chung Li City, Taiwan, ROC aut NATIONALLICENCE 700 1- Li Meng-Hui Department of Chemical Engineering and R&D Center for Membrane Technology, Chung Yuan Christian University, 32023, Chung Li City, Taiwan, ROC aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2648-2657 0361-5235 42:8<2648 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer