naa a22 4500 510804438 CHVBK 20180411083410.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2613-0 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2613-0 Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates [Elektronische Daten] [Ahmed Sharif, Jun Lim, Riko Made, Fu Lau, Eric Phua, Ju Lim, Chee Wong, Chee Gan, Zhong Chen] A lead-free glass frit paste as a die-attach material for high-temperature microelectronic application is proposed in this study. The glass paste containing Bi-based powder with a moderate amount of solvent was used for joining Si dice on ceramic substrates without any metallization preparation for either of the bonding surfaces. The die was bonded to a ceramic substrate at 430°C for 10min. The study focuses on the mechanical and microstructural characterization of the joints with Si dice on two different types of ceramic substrate. Shear strength measurements were carried out at both ambient and 250°C to evaluate room- and high-temperature performance. Furthermore, the effect of aging at 300°C for 500h on the mechanical properties is presented. The results of the mechanical and microstructural characterization demonstrate that low-temperature glass frit bonding is an effective die-attach method for harsh-environment electronic packaging. TMS, 2013 Ruggedized electronics nationallicence die attach nationallicence glass paste nationallicence high-temperature reliability nationallicence ceramic substrates nationallicence Sharif Ahmed School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut Lim Jun School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut Made Riko School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut Lau Fu School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut Phua Eric School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut Lim Ju School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut Wong Chee School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut Gan Chee School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut Chen Zhong School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2667-2676 0361-5235 42:8<2667 2013 42 11664 https://doi.org/10.1007/s11664-013-2613-0 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2613-0 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Sharif Ahmed School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut NATIONALLICENCE 700 1- Lim Jun School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut NATIONALLICENCE 700 1- Made Riko School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut NATIONALLICENCE 700 1- Lau Fu School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut NATIONALLICENCE 700 1- Phua Eric School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut NATIONALLICENCE 700 1- Lim Ju School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut NATIONALLICENCE 700 1- Wong Chee School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut NATIONALLICENCE 700 1- Gan Chee School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut NATIONALLICENCE 700 1- Chen Zhong School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore, Singapore aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2667-2676 0361-5235 42:8<2667 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer