naa a22 4500 510804462 CHVBK 20180411083410.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2619-7 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2619-7 Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates [Elektronische Daten] [Satyanarayan,, K. Prabhu] The effect of surface roughness of copper substrate on the reactive wetting of Sn-Ag-Cu solder alloys and morphology of intermetallic compounds (IMCs) was investigated. The spreading behavior of solder alloys on smooth and rough Cu substrates was categorized into capillary, diffusion/reaction, and contact angle stabilization zones. The increase in substrate surface roughness improved the wetting of solder alloys, being attributed to the presence of thick Cu3Sn IMC at the interface. The morphology of IMCs transformed from long needle shaped to short protruded type with an increase in the substrate surface roughness for the Sn-0.3Ag-0.7Cu and Sn-3Ag-0.5Cu solder alloys. However, for the Sn-2.5Ag-0.5Cu solder alloy the needle-shaped IMCs transformed to the completely scallop type with increase in the substrate surface roughness. The effect of Ag content on wetting behavior was not significant. TMS, 2013 Reactive wetting nationallicence lead-free solders nationallicence contact angle nationallicence IMC nationallicence Satyanarayan, Department of Metallurgical & Materials Engineering, National Institute of Technology Karnataka, Surathkal, 575025, Mangalore, India aut Prabhu K. Department of Metallurgical & Materials Engineering, National Institute of Technology Karnataka, Surathkal, 575025, Mangalore, India aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2696-2707 0361-5235 42:8<2696 2013 42 11664 https://doi.org/10.1007/s11664-013-2619-7 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2619-7 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Satyanarayan Department of Metallurgical & Materials Engineering, National Institute of Technology Karnataka, Surathkal, 575025, Mangalore, India aut NATIONALLICENCE 700 1- Prabhu K. Department of Metallurgical & Materials Engineering, National Institute of Technology Karnataka, Surathkal, 575025, Mangalore, India aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2696-2707 0361-5235 42:8<2696 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer