naa a22 4500 510804470 CHVBK 20180411083410.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2620-1 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2620-1 Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder [Elektronische Daten] [Xu Chen, Feng Xue, Jian Zhou, Sidong Liu, Guotong Qian] The microstructures, phase transformations, and wettability of Sn-Bi-Zn solder alloys were investigated by scanning electron microscopy, x-ray diffraction, and differential scanning calorimetry (DSC). The results show that the alloys are composed of primary Sn-rich phase or Zn-rich phase, (Sn+Zn) eutectic structure, and (Sn+Bi+Zn) ternary eutectic structure. The microstructural characterization of Sn-xBi-Zn alloys indicates that, with increasing Bi content, more of the eutectic (Sn-Bi-Zn) structures is formed. DSC profiles reveal that the eutectic peak of the samples did not differ very much, but the reaction temperature of the alloys decreases with increased Bi content. The spreading rates of solders increased with the addition of Zn, which affects the interfacial reactions between the solders and copper. TMS, 2013 Lead-free solder nationallicence Sn-Bi-Zn nationallicence microstructure nationallicence melting point nationallicence wettability nationallicence Chen Xu Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Jiulonghu Campus, Jiangning District, 211189, Nanjing, China aut Xue Feng Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Jiulonghu Campus, Jiangning District, 211189, Nanjing, China aut Zhou Jian Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Jiulonghu Campus, Jiangning District, 211189, Nanjing, China aut Liu Sidong Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Jiulonghu Campus, Jiangning District, 211189, Nanjing, China aut Qian Guotong Damno Tin Materials Co. Ltd., 312001, Shaoxing, China aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2708-2715 0361-5235 42:8<2708 2013 42 11664 https://doi.org/10.1007/s11664-013-2620-1 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2620-1 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Chen Xu Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Jiulonghu Campus, Jiangning District, 211189, Nanjing, China aut NATIONALLICENCE 700 1- Xue Feng Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Jiulonghu Campus, Jiangning District, 211189, Nanjing, China aut NATIONALLICENCE 700 1- Zhou Jian Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Jiulonghu Campus, Jiangning District, 211189, Nanjing, China aut NATIONALLICENCE 700 1- Liu Sidong Jiangsu Key Laboratory for Advanced Metallic Materials, Southeast University, Jiulonghu Campus, Jiangning District, 211189, Nanjing, China aut NATIONALLICENCE 700 1- Qian Guotong Damno Tin Materials Co. Ltd., 312001, Shaoxing, China aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2708-2715 0361-5235 42:8<2708 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer