naa a22 4500 510804519 CHVBK 20180411083410.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2576-1 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2576-1 Copper Wire Bonding Concerns and Best Practices [Elektronische Daten] [Preeti Chauhan, Z. Zhong, Michael Pecht] Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of gold wire bonding. However, with this new technology, changes in the bonding processes as well as bonding metallurgy can affect product reliability. This paper discusses the challenges associated with copper wire bonding and the solutions that the industry has been implementing. The paper also provides information to enable customers to conduct qualification and reliability tests on microelectronic packages to facilitate adoption in their target applications. TMS, 2013 Wire bonding nationallicence copper nationallicence gold nationallicence oxidation nationallicence corrosion nationallicence humidity nationallicence Chauhan Preeti CALCE Electronic Products and Systems Center, University of Maryland, 20742, College Park, MD, USA aut Zhong Z. School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore aut Pecht Michael CALCE Electronic Products and Systems Center, University of Maryland, 20742, College Park, MD, USA aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2415-2434 0361-5235 42:8<2415 2013 42 11664 https://doi.org/10.1007/s11664-013-2576-1 text/html Onlinezugriff via DOI 1 review-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2576-1 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Chauhan Preeti CALCE Electronic Products and Systems Center, University of Maryland, 20742, College Park, MD, USA aut NATIONALLICENCE 700 1- Zhong Z. School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore aut NATIONALLICENCE 700 1- Pecht Michael CALCE Electronic Products and Systems Center, University of Maryland, 20742, College Park, MD, USA aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2415-2434 0361-5235 42:8<2415 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer