naa a22 4500 510804780 CHVBK 20180411083411.0 cr unu---uuuuu 180411e20130201xx s 000 0 eng 10.1007/s11664-012-2341-x doi (NATIONALLICENCE)springer-10.1007/s11664-012-2341-x An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints [Elektronische Daten] [Govindarajan Muralidharan, Kanth Kurumaddali, Andrew Kercher, Larry Walker, Scott Leslie] There is a need for next-generation, high-performance power electronic packages and systems utilizing wide-band-gap devices to operate at high temperatures in automotive and electricity transmission applications. Sn-3.5Ag solder is a candidate for use in such packages with potential maximum operating temperatures of about 200°C. However, there is a need to understand the thermal cycling reliability of Sn-3.5Ag solders subject to such high-temperature operating conditions. The results of a study on the damage evolution occurring in large-area Sn-3.5Ag solder joints between silicon dies and direct bonded copper substrates with Au/Ni-P metallization subject to thermal cycling between 200°C and 5°C are presented in this paper. Interface structure evolution and damage accumulation were followed using high-resolution X-ray radiography, cross-sectional optical and scanning electron microscopies, and X-ray microanalysis in these joints for up to 3000 thermal cycles. Optical and scanning electron microscopy results showed that the stresses introduced by the thermal cycling result in cracking and delamination at the copper-intermetallic compound interface. X-ray microanalysis showed that stresses due to thermal cycling resulted in physical cracking and breakdown of the Ni-P barrier layer, facilitating Cu-Sn interdiffusion. This interdiffusion resulted in the formation of Cu-Sn intermetallic compounds underneath the Ni-P layer, subsequently leading to delamination between the Ni-rich layer and Cu-Sn intermetallic compounds. TMS (outside the USA), 2012 High-temperature packaging nationallicence power electronics nationallicence X-ray imaging nationallicence creep nationallicence fatigue nationallicence intermetallic compounds nationallicence Muralidharan Govindarajan Materials Science and Technology Division, Oak Ridge National Laboratory, Bldg 4508, MS-6083, Bethel Valley Road, 37831-6083, Oak Ridge, TN, USA aut Kurumaddali Kanth Materials Science and Technology Division, Oak Ridge National Laboratory, Bldg 4508, MS-6083, Bethel Valley Road, 37831-6083, Oak Ridge, TN, USA aut Kercher Andrew Materials Science and Technology Division, Oak Ridge National Laboratory, Bldg 4508, MS-6083, Bethel Valley Road, 37831-6083, Oak Ridge, TN, USA aut Walker Larry Materials Science and Technology Division, Oak Ridge National Laboratory, Bldg 4508, MS-6083, Bethel Valley Road, 37831-6083, Oak Ridge, TN, USA aut Leslie Scott Powerex Inc., 173 Pavilion Lane, 15697, Youngwood, PA, USA aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 240-248 0361-5235 42:2<240 2013 42 11664 https://doi.org/10.1007/s11664-012-2341-x text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2341-x text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Muralidharan Govindarajan Materials Science and Technology Division, Oak Ridge National Laboratory, Bldg 4508, MS-6083, Bethel Valley Road, 37831-6083, Oak Ridge, TN, USA aut NATIONALLICENCE 700 1- Kurumaddali Kanth Materials Science and Technology Division, Oak Ridge National Laboratory, Bldg 4508, MS-6083, Bethel Valley Road, 37831-6083, Oak Ridge, TN, USA aut NATIONALLICENCE 700 1- Kercher Andrew Materials Science and Technology Division, Oak Ridge National Laboratory, Bldg 4508, MS-6083, Bethel Valley Road, 37831-6083, Oak Ridge, TN, USA aut NATIONALLICENCE 700 1- Walker Larry Materials Science and Technology Division, Oak Ridge National Laboratory, Bldg 4508, MS-6083, Bethel Valley Road, 37831-6083, Oak Ridge, TN, USA aut NATIONALLICENCE 700 1- Leslie Scott Powerex Inc., 173 Pavilion Lane, 15697, Youngwood, PA, USA aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 240-248 0361-5235 42:2<240 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer