naa a22 4500 510804799 CHVBK 20180411083411.0 cr unu---uuuuu 180411e20130201xx s 000 0 eng 10.1007/s11664-012-2340-y doi (NATIONALLICENCE)springer-10.1007/s11664-012-2340-y The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance [Elektronische Daten] [Tae-Kyu Lee, Bite Zhou, Thomas Bieler, Chien-Fu Tseng, Jeng-Gong Duh] The mechanical stability of solder joints with Pd added to Sn-Ag-Cu alloy with different aging conditions was investigated in a high-G level shock environment. A test vehicle with three different strain and shock level conditions in one board was used to identify the joint stability and failure modes. The results revealed that Pd provided stability at the package-side interface with an overall shock performance improvement of over 65% compared with the Sn-Ag-Cu alloy without Pd. A dependency on the pad structure was also identified. However, the strengthening mechanism was only observed in the non-solder mask defined (NSMD) pad design, whereas the solder mask defined (SMD) pad design boards showed no improvement in shock performance with Pd-added solders. The effects of Sn grain orientation on shock performance, interconnect stability, and crack propagation path with and without Pd are discussed. The SAC305+Pd solder joints showed more grain refinements, recrystallization, and especially mechanical twin deformation during the shock test, which provides a partial explanation for the ability of SAC305+Pd to absorb more shock-induced energy through active deformation compared with SAC305. TMS, 2012 Pb-free solder nationallicence Pd, Sn orientation nationallicence shock test nationallicence interconnect nationallicence microalloying nationallicence Lee Tae-Kyu Component Quality and Technology Group, Cisco Systems, Inc., 95134, San Jose, CA, USA aut Zhou Bite Michigan State University, East Lansing, MI, USA aut Bieler Thomas Michigan State University, East Lansing, MI, USA aut Tseng Chien-Fu National Tsing Hua University, Hsinchu, Taiwan aut Duh Jeng-Gong National Tsing Hua University, Hsinchu, Taiwan aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 215-223 0361-5235 42:2<215 2013 42 11664 https://doi.org/10.1007/s11664-012-2340-y text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2340-y text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Lee Tae-Kyu Component Quality and Technology Group, Cisco Systems, Inc., 95134, San Jose, CA, USA aut NATIONALLICENCE 700 1- Zhou Bite Michigan State University, East Lansing, MI, USA aut NATIONALLICENCE 700 1- Bieler Thomas Michigan State University, East Lansing, MI, USA aut NATIONALLICENCE 700 1- Tseng Chien-Fu National Tsing Hua University, Hsinchu, Taiwan aut NATIONALLICENCE 700 1- Duh Jeng-Gong National Tsing Hua University, Hsinchu, Taiwan aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 215-223 0361-5235 42:2<215 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer