naa a22 4500 510804829 CHVBK 20180411083412.0 cr unu---uuuuu 180411e20130201xx s 000 0 eng 10.1007/s11664-012-2310-4 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2310-4 Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches [Elektronische Daten] [Ran Zhao, Limin Ma, Yong Zuo, Sihan Liu, Fu Guo] The voids induced by electromigration (EM) can trigger serious failure across the entire cathode interface of solder joints. In this study, alloying and composite approaches showed great potential for inhibiting EM in lead-free solder joints. Microsized Ni, Co, and Sb particles were added to the solder matrix. Cu and Sn particles were added to the melting solder to form insitu Cu6Sn5, which formed a barrier layer in the underbump metallization of flip-chip solder joints. The polarity effect induced by EM was observed to be significantly inhibited in the alloyed and composite solder joints. This indicates that the Sn-Ni, Sn-Co, Sn-Sb, and Cu6Sn5 intermetallic compounds may act as barriers to obstruct the movement of the dominant diffusion species along phase boundaries, which in turn improves the resistance to EM. However, Sb particles could induce crack formation and propagation that might lead to joint fracture. TMS, 2012 Lead-free solder nationallicence alloying approach nationallicence composite approach nationallicence retarding EM nationallicence Zhao Ran College of Materials Science and Engineering, Beijing University of Technology, 100124, Beijing, People's Republic of China aut Ma Limin College of Materials Science and Engineering, Beijing University of Technology, 100124, Beijing, People's Republic of China aut Zuo Yong College of Materials Science and Engineering, Beijing University of Technology, 100124, Beijing, People's Republic of China aut Liu Sihan College of Materials Science and Engineering, Beijing University of Technology, 100124, Beijing, People's Republic of China aut Guo Fu College of Materials Science and Engineering, Beijing University of Technology, 100124, Beijing, People's Republic of China aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 280-287 0361-5235 42:2<280 2013 42 11664 https://doi.org/10.1007/s11664-012-2310-4 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2310-4 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Zhao Ran College of Materials Science and Engineering, Beijing University of Technology, 100124, Beijing, People's Republic of China aut NATIONALLICENCE 700 1- Ma Limin College of Materials Science and Engineering, Beijing University of Technology, 100124, Beijing, People's Republic of China aut NATIONALLICENCE 700 1- Zuo Yong College of Materials Science and Engineering, Beijing University of Technology, 100124, Beijing, People's Republic of China aut NATIONALLICENCE 700 1- Liu Sihan College of Materials Science and Engineering, Beijing University of Technology, 100124, Beijing, People's Republic of China aut NATIONALLICENCE 700 1- Guo Fu College of Materials Science and Engineering, Beijing University of Technology, 100124, Beijing, People's Republic of China aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 280-287 0361-5235 42:2<280 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer