naa a22 4500 510804845 CHVBK 20180411083412.0 cr unu---uuuuu 180411e20130201xx s 000 0 eng 10.1007/s11664-012-2227-y doi (NATIONALLICENCE)springer-10.1007/s11664-012-2227-y Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures [Elektronische Daten] [Dekui Mu, Han Huang, Stuart McDonald, Kazuhiro Nogita] Cu6Sn5 is the most common and important intermetallic compound (IMC) formed between Sn-based solders and Cu substrates during soldering. The Cu6Sn5 IMC exhibits significantly different thermomechanical properties from the solder alloys and the substrate. The progress of high-density three-dimensional (3D) electrical packaging technologies has led to increased operating temperatures, and interfacial Cu6Sn5 accounts for a larger volume fraction of the fine-pitch solder joints in these packages. Knowledge of creep and the mechanical behavior of Cu6Sn5 at elevated temperatures is therefore essential to understanding the deformation of a lead-free solder joint in service. In this work, the effects of temperature and Ni solubility on creep and mechanical properties of Cu6Sn5 were investigated using energy-dispersive x-ray spectroscopy and nanoindentation. The reduced modulus and hardness of Cu6Sn5 were found to decrease as temperature increased from 25°C to 150°C. The addition of Ni increased the reduced modulus and hardness of Cu6Sn5 and had different effects on the creep of Cu6Sn5 at room and elevated temperatures. TMS, 2012 Intermetallic compounds nationallicence nanoindentation nationallicence mechanical properties nationallicence lead-free solder nationallicence Mu Dekui Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical & Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut Huang Han School of Mechanical & Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut McDonald Stuart Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical & Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut Nogita Kazuhiro Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical & Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 304-311 0361-5235 42:2<304 2013 42 11664 https://doi.org/10.1007/s11664-012-2227-y text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2227-y text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Mu Dekui Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical & Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut NATIONALLICENCE 700 1- Huang Han School of Mechanical & Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut NATIONALLICENCE 700 1- McDonald Stuart Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical & Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut NATIONALLICENCE 700 1- Nogita Kazuhiro Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical & Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 304-311 0361-5235 42:2<304 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer