naa a22 4500 510804861 CHVBK 20180411083412.0 cr unu---uuuuu 180411e20130201xx s 000 0 eng 10.1007/s11664-012-2308-y doi (NATIONALLICENCE)springer-10.1007/s11664-012-2308-y Mitigation and Verification Methods for Sn Whisker Growthin Pb-Free Automotive Electronics [Elektronische Daten] [Won Hong, Chul Oh, Do Kim] This work describes mitigation methods against Sn whisker growth in Pb-free automotive electronics using a conformal coating technique, with an additional focus on determining an effective whisker assessment method. We suggest effective whisker growth conditions that involve temperature cycling and two types of storage conditions (high-temperature/humidity storage and ambient storage), and analyze whisker growth mechanisms. In determining an efficient mitigation method against whisker growth, surface finish and conformal coating have been validated as effective means. In our experiments, the surface finish of components comprised Ni/Sn, Ni/SnBi, and Ni/Pd. The effects of acrylic silicone, and rubber coating of components were compared with uncoated performance under high-temperature/humidity storage conditions. An effective whisker assessment method during temperature cycling and under various storage conditions (high temperature/humidity and ambient) is indicated for evaluating whisker growth. Although components were finished with Ni/Pd, we found that whiskers were generated at solder joints and that conformal coating is a useful mitigation method in this regard. Although whiskers penetrated most conformal coating materials (acrylic, silicone, and rubber) after 3500h of high-temperature/humidity storage, the whisker length was markedly reduced due to the conformal coatings, with silicone providing superior mitigation over acrylic and rubber. TMS, 2012 Whisker nationallicence growth mechanism nationallicence mitigation nationallicence conformal coating nationallicence automotive electronics nationallicence Hong Won Components & Materials Physics Research Center, Korea Electronics Technology Institute (KETI), #68 Bundang-gu, 463-816, Yatap-dong, Gyeonggi-do, Republic of Korea aut Oh Chul Components & Materials Physics Research Center, Korea Electronics Technology Institute (KETI), #68 Bundang-gu, 463-816, Yatap-dong, Gyeonggi-do, Republic of Korea aut Kim Do Electronics Reliability Development Team, Hyundai Motor Company, Seoul, Republic of Korea aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 332-347 0361-5235 42:2<332 2013 42 11664 https://doi.org/10.1007/s11664-012-2308-y text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2308-y text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Hong Won Components & Materials Physics Research Center, Korea Electronics Technology Institute (KETI), #68 Bundang-gu, 463-816, Yatap-dong, Gyeonggi-do, Republic of Korea aut NATIONALLICENCE 700 1- Oh Chul Components & Materials Physics Research Center, Korea Electronics Technology Institute (KETI), #68 Bundang-gu, 463-816, Yatap-dong, Gyeonggi-do, Republic of Korea aut NATIONALLICENCE 700 1- Kim Do Electronics Reliability Development Team, Hyundai Motor Company, Seoul, Republic of Korea aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 332-347 0361-5235 42:2<332 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer