<?xml version="1.0" encoding="UTF-8"?>
<collection xmlns="http://www.loc.gov/MARC21/slim">
 <record>
  <leader>     naa a22        4500</leader>
  <controlfield tag="001">510804888</controlfield>
  <controlfield tag="003">CHVBK</controlfield>
  <controlfield tag="005">20180411083412.0</controlfield>
  <controlfield tag="007">cr unu---uuuuu</controlfield>
  <controlfield tag="008">180411e20130201xx      s     000 0 eng  </controlfield>
  <datafield tag="024" ind1="7" ind2="0">
   <subfield code="a">10.1007/s11664-012-2201-8</subfield>
   <subfield code="2">doi</subfield>
  </datafield>
  <datafield tag="035" ind1=" " ind2=" ">
   <subfield code="a">(NATIONALLICENCE)springer-10.1007/s11664-012-2201-8</subfield>
  </datafield>
  <datafield tag="245" ind1="0" ind2="0">
   <subfield code="a">Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects</subfield>
   <subfield code="h">[Elektronische Daten]</subfield>
   <subfield code="c">[Zhiyong Wu, Zhiheng Huang, Hua Xiong, Paul Conway, Changqing Liu]</subfield>
  </datafield>
  <datafield tag="520" ind1="3" ind2=" ">
   <subfield code="a">Microstructures within ultrafine electronic interconnections, which change rapidly during the formation of such joints and evolve continuously thereafter under service conditions, are an important factor to be considered in order to accurately evaluate the reliability of electronic packages that contain such interconnects. By combining phase-field and finite-element mechanical modeling techniques, this work explicitly considers both the size and geometry of the joints to understand their effects on microstructural evolution and subsequent mechanical properties. The simulation results indicate that the degree of inhomogeneity of the stress distribution increases as the size of the joints is reduced when microstructure is considered. The calculated maximum stresses present in hourglass-shaped joints when considering microstructure are approximately 10MPa larger than those present in the corresponding joints when neglecting microstructure. The geometries of such interconnects also have a significant effect on their mechanical properties. Hourglass-shaped joints exhibit the lowest maximum von Mises stresses in comparison with the other shapes considered. In addition, the included microstructural features can introduce local stress concentrations within the microjoints, which may deteriorate the reliability and performance of the electronic packages. It is therefore recommended that the microstructure as well as the size and geometry of joints be considered among the design and fabrication parameters to enable reliable ultrafine interconnects.</subfield>
  </datafield>
  <datafield tag="540" ind1=" " ind2=" ">
   <subfield code="a">TMS, 2012</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">Microstructure</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">size and geometry effects</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">mechanical properties</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">phase-field method</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">ultrafine interconnects</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Wu</subfield>
   <subfield code="D">Zhiyong</subfield>
   <subfield code="u">School of Physics and Engineering, Sun Yat-sen University, 135 West Xingang Road, Guangzhou, China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Huang</subfield>
   <subfield code="D">Zhiheng</subfield>
   <subfield code="u">School of Physics and Engineering, Sun Yat-sen University, 135 West Xingang Road, Guangzhou, China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Xiong</subfield>
   <subfield code="D">Hua</subfield>
   <subfield code="u">School of Physics and Engineering, Sun Yat-sen University, 135 West Xingang Road, Guangzhou, China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Conway</subfield>
   <subfield code="D">Paul</subfield>
   <subfield code="u">Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, LE11 3TU, Loughborough, Leicestershire, UK</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Liu</subfield>
   <subfield code="D">Changqing</subfield>
   <subfield code="u">Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, LE11 3TU, Loughborough, Leicestershire, UK</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="773" ind1="0" ind2=" ">
   <subfield code="t">Journal of Electronic Materials</subfield>
   <subfield code="d">Springer US; http://www.springer-ny.com</subfield>
   <subfield code="g">42/2(2013-02-01), 263-271</subfield>
   <subfield code="x">0361-5235</subfield>
   <subfield code="q">42:2&lt;263</subfield>
   <subfield code="1">2013</subfield>
   <subfield code="2">42</subfield>
   <subfield code="o">11664</subfield>
  </datafield>
  <datafield tag="856" ind1="4" ind2="0">
   <subfield code="u">https://doi.org/10.1007/s11664-012-2201-8</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="908" ind1=" " ind2=" ">
   <subfield code="D">1</subfield>
   <subfield code="a">research-article</subfield>
   <subfield code="2">jats</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">856</subfield>
   <subfield code="E">40</subfield>
   <subfield code="u">https://doi.org/10.1007/s11664-012-2201-8</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Wu</subfield>
   <subfield code="D">Zhiyong</subfield>
   <subfield code="u">School of Physics and Engineering, Sun Yat-sen University, 135 West Xingang Road, Guangzhou, China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Huang</subfield>
   <subfield code="D">Zhiheng</subfield>
   <subfield code="u">School of Physics and Engineering, Sun Yat-sen University, 135 West Xingang Road, Guangzhou, China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Xiong</subfield>
   <subfield code="D">Hua</subfield>
   <subfield code="u">School of Physics and Engineering, Sun Yat-sen University, 135 West Xingang Road, Guangzhou, China</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Conway</subfield>
   <subfield code="D">Paul</subfield>
   <subfield code="u">Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, LE11 3TU, Loughborough, Leicestershire, UK</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Liu</subfield>
   <subfield code="D">Changqing</subfield>
   <subfield code="u">Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, LE11 3TU, Loughborough, Leicestershire, UK</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">773</subfield>
   <subfield code="E">0-</subfield>
   <subfield code="t">Journal of Electronic Materials</subfield>
   <subfield code="d">Springer US; http://www.springer-ny.com</subfield>
   <subfield code="g">42/2(2013-02-01), 263-271</subfield>
   <subfield code="x">0361-5235</subfield>
   <subfield code="q">42:2&lt;263</subfield>
   <subfield code="1">2013</subfield>
   <subfield code="2">42</subfield>
   <subfield code="o">11664</subfield>
  </datafield>
  <datafield tag="900" ind1=" " ind2="7">
   <subfield code="a">Metadata rights reserved</subfield>
   <subfield code="b">Springer special CC-BY-NC licence</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="898" ind1=" " ind2=" ">
   <subfield code="a">BK010053</subfield>
   <subfield code="b">XK010053</subfield>
   <subfield code="c">XK010000</subfield>
  </datafield>
  <datafield tag="949" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="F">NATIONALLICENCE</subfield>
   <subfield code="b">NL-springer</subfield>
  </datafield>
 </record>
</collection>
