naa a22 4500 510804896 CHVBK 20180411083412.0 cr unu---uuuuu 180411e20130201xx s 000 0 eng 10.1007/s11664-012-2274-4 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2274-4 Conductive Anodic Filament Failures in Fine-PitchThrough-Via Interconnections in Organic Package Substrates [Elektronische Daten] [Koushik Ramachandran, Fuhan Liu, P. Raj, Venky Sundaram, Rao Tummala] Failures due to conductive anodic filament (CAF) formation in copper-plated through-vias have been a concern in printed wiring boards since the 1970s. With the continuous reduction in through-via pitch to meet high circuit density demands in organic packages, the magnitude of CAF failures is expected to be significantly higher. In this study, an accelerated test condition [130°C, 85% relative humidity (RH), and 100V direct current (DC)] was used to investigate CAF in two organic package substrates: (1) cyclo-olefin polymer-glass fiber composite (XR3) and (2) epoxy-glass fiber composite (FR4). Test coupons with through-via spacing of 100μm and 200μm were investigated in this study. CAF failures were not observed in either substrate type with spacing of 200μm. With spacing of 100μm, insulation failures were observed in FR4, while XR3 exhibited stable insulation resistance during the test. The substrates were characterized using gravimetric measurement, and XR3 was found to exhibit significantly lower moisture absorption compared with FR4. The CAF failures in FR4 were characterized using scanning electron microscopy and energy-dispersive x-ray spectroscopy. The results suggest a strong effect of moisture sorption of organic resins on CAF failure at smaller through-via spacing in package substrates. TMS, 2012 Conductive anodic filament nationallicence organic package substrates nationallicence fine-pitch through-vias nationallicence electrochemical migration nationallicence Ramachandran Koushik 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, 30332-0250, Atlanta, GA, USA aut Liu Fuhan 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, 30332-0250, Atlanta, GA, USA aut Raj P. 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, 30332-0250, Atlanta, GA, USA aut Sundaram Venky 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, 30332-0250, Atlanta, GA, USA aut Tummala Rao 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, 30332-0250, Atlanta, GA, USA aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 348-354 0361-5235 42:2<348 2013 42 11664 https://doi.org/10.1007/s11664-012-2274-4 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2274-4 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Ramachandran Koushik 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, 30332-0250, Atlanta, GA, USA aut NATIONALLICENCE 700 1- Liu Fuhan 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, 30332-0250, Atlanta, GA, USA aut NATIONALLICENCE 700 1- Raj P. 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, 30332-0250, Atlanta, GA, USA aut NATIONALLICENCE 700 1- Sundaram Venky 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, 30332-0250, Atlanta, GA, USA aut NATIONALLICENCE 700 1- Tummala Rao 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, 30332-0250, Atlanta, GA, USA aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 348-354 0361-5235 42:2<348 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer