naa a22 4500 51080490X CHVBK 20180411083412.0 cr unu---uuuuu 180411e20130201xx s 000 0 eng 10.1007/s11664-012-2276-2 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2276-2 Characterization of Stress-Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling [Elektronische Daten] [G. Khatibi, M. Lederer, E. Byrne, A. Kotas, B. Weiss, H. Ipser] The stress-strain response of miniaturized Sn-Ag-Cu (SAC) lead-free solder joints in the thickness range of 80μm to about 1.1mm was studied. A high-resolution three-dimensional (3D) digital image correlation system was used for insitu measurement of displacement and strain fields in the solder joints during tensile testing. These measurements showed that the localization of plastic strain and stress buildup occurs mainly at the interface of the solder. With increasing solder gap thickness the size of the plastically deformed zone in the solder increases, resulting in transformation of a brittle interfacial fracture to a ductile fracture within the bulk of the solder. The experimental deformation plots of solder joints and strain-rate-dependent tensile tests on bulk solder material were used to establish a new constitutive material model for the solder. This strain-rate- and pressure-dependent material model was implemented in ABAQUS through the user subroutine CREEP. In agreement with the experiments, the finite-element method simulation revealed a pronounced thickness effect leading to higher tensile strength of thinner solder joints. TMS, 2012 Lead-free solder joints nationallicence constraint effect nationallicence plastic deformation nationallicence digital image correlation nationallicence material modeling nationallicence FEM simulation nationallicence Khatibi G. Faculty of Physics, University of Vienna, Boltzmanngasse 5, 1090, Vienna, Austria aut Lederer M. Faculty of Physics, University of Vienna, Boltzmanngasse 5, 1090, Vienna, Austria aut Byrne E. Correlated Solutions Inc., Columbia, SC, USA aut Kotas A. Faculty of Physics, University of Vienna, Boltzmanngasse 5, 1090, Vienna, Austria aut Weiss B. Faculty of Physics, University of Vienna, Boltzmanngasse 5, 1090, Vienna, Austria aut Ipser H. Department of Inorganic Chemistry, University of Vienna, Waehringerstr. 42, 1090, Vienna, Austria aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 294-303 0361-5235 42:2<294 2013 42 11664 https://doi.org/10.1007/s11664-012-2276-2 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2276-2 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Khatibi G. Faculty of Physics, University of Vienna, Boltzmanngasse 5, 1090, Vienna, Austria aut NATIONALLICENCE 700 1- Lederer M. Faculty of Physics, University of Vienna, Boltzmanngasse 5, 1090, Vienna, Austria aut NATIONALLICENCE 700 1- Byrne E. Correlated Solutions Inc., Columbia, SC, USA aut NATIONALLICENCE 700 1- Kotas A. Faculty of Physics, University of Vienna, Boltzmanngasse 5, 1090, Vienna, Austria aut NATIONALLICENCE 700 1- Weiss B. Faculty of Physics, University of Vienna, Boltzmanngasse 5, 1090, Vienna, Austria aut NATIONALLICENCE 700 1- Ipser H. Department of Inorganic Chemistry, University of Vienna, Waehringerstr. 42, 1090, Vienna, Austria aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 294-303 0361-5235 42:2<294 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer