naa a22 4500 510804942 CHVBK 20180411083412.0 cr unu---uuuuu 180411e20130201xx s 000 0 eng 10.1007/s11664-012-2222-3 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2222-3 Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys [Elektronische Daten] [Stuart McDonald, Kazuhiro Nogita, Jonathan Read, Tina Ventura, Tetsuro Nishimura] Alloys from the composition range Sn-(0.7wt.% to 7.6wt.%)Cu consist of primary Cu6Sn5 surrounded by a eutectic Sn-Cu6Sn5 mixture. The primary Cu6Sn5 intermetallics commonly adopt a coarse elongated morphology, which is not optimal for the mechanical properties of the soldered joint. This paper investigates the effect of trace elemental additions on the size and morphology of the primary Cu6Sn5 in Sn-4wt.%Cu alloy with and without Ni additions. Elements investigated include ppm additions of Al, Ag, Ge, and Pb. It is shown that Al has a marked effect on the solder microstructure and refines the size of the primary Cu6Sn5, even at very low addition levels, in both binary Sn-Cu alloys and those containing additional Ni. The effect of Al is confirmed using real-time x-radiographic synchrotron observations of solidification. TMS, 2012 Lead-free solder nationallicence Cu6Sn5 nationallicence grain refinement nationallicence solidification nationallicence synchrotron nationallicence McDonald Stuart Nihon Superior Centre for the Manufacture of Electronic Materials School of Mechanical and Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut Nogita Kazuhiro Nihon Superior Centre for the Manufacture of Electronic Materials School of Mechanical and Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut Read Jonathan Nihon Superior Centre for the Manufacture of Electronic Materials School of Mechanical and Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut Ventura Tina Nihon Superior Centre for the Manufacture of Electronic Materials School of Mechanical and Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut Nishimura Tetsuro Nihon Superior Co., Ltd., Osaka, Japan aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 256-262 0361-5235 42:2<256 2013 42 11664 https://doi.org/10.1007/s11664-012-2222-3 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2222-3 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- McDonald Stuart Nihon Superior Centre for the Manufacture of Electronic Materials School of Mechanical and Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut NATIONALLICENCE 700 1- Nogita Kazuhiro Nihon Superior Centre for the Manufacture of Electronic Materials School of Mechanical and Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut NATIONALLICENCE 700 1- Read Jonathan Nihon Superior Centre for the Manufacture of Electronic Materials School of Mechanical and Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut NATIONALLICENCE 700 1- Ventura Tina Nihon Superior Centre for the Manufacture of Electronic Materials School of Mechanical and Mining Engineering, The University of Queensland, 4072, Brisbane, QLD, Australia aut NATIONALLICENCE 700 1- Nishimura Tetsuro Nihon Superior Co., Ltd., Osaka, Japan aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/2(2013-02-01), 256-262 0361-5235 42:2<256 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer