<?xml version="1.0" encoding="UTF-8"?>
<collection xmlns="http://www.loc.gov/MARC21/slim">
 <record>
  <leader>     naa a22        4500</leader>
  <controlfield tag="001">51080537X</controlfield>
  <controlfield tag="003">CHVBK</controlfield>
  <controlfield tag="005">20180411083415.0</controlfield>
  <controlfield tag="007">cr unu---uuuuu</controlfield>
  <controlfield tag="008">180411e20131101xx      s     000 0 eng  </controlfield>
  <datafield tag="024" ind1="7" ind2="0">
   <subfield code="a">10.1007/s11664-013-2773-y</subfield>
   <subfield code="2">doi</subfield>
  </datafield>
  <datafield tag="035" ind1=" " ind2=" ">
   <subfield code="a">(NATIONALLICENCE)springer-10.1007/s11664-013-2773-y</subfield>
  </datafield>
  <datafield tag="245" ind1="0" ind2="0">
   <subfield code="a">Design of Dislocation-Compensated ZnS y Se1− y /GaAs (001) Heterostructures</subfield>
   <subfield code="h">[Elektronische Daten]</subfield>
   <subfield code="c">[T. Kujofsa, J.E. Ayers]</subfield>
  </datafield>
  <datafield tag="520" ind1="3" ind2=" ">
   <subfield code="a">The understanding of lattice relaxation and dislocation dynamics in lattice-mismatched semiconductors makes it possible to design metamorphic device structures utilizing the dislocation compensation mechanism for reduced defects, improved performance, and enhanced reliability. We have developed a dislocation dynamics model accounting for misfit-threading interactions and have applied it to ZnS y Se1−y /GaAs (001) heterostructures.1 Dislocation compensation involves the removal of threading dislocations associated with one sense of misfit dislocations by bending them over to create misfit dislocations of the opposite sense at an intentionally mismatched interface. Here we investigated the design of dislocation-compensated ZnS y Se1−y /GaAs (001) heterostructures and considered the sulfur mole fraction tolerances applicable to such structures. We considered two types of structures: typeA involved a uniform-composition (ungraded) layer on top of a uniform-composition buffer, while typeB involved a uniform-composition layer on a linearly graded buffer. For each structure type we studied the requirements on the thickness and compositional profile of the buffer layer to optimize the removal of mobile threading dislocations from the top uniform (device) layer as well as the allowed tolerance in compositional overshoot to achieve structures with low threading dislocation density. We show for both types of structure that (i) for given compositional overshoot at the buffer-device layer interface, there is an optimum buffer thickness which minimizes the dislocation density; and (ii) for given buffer thickness there is an optimum overshoot which minimizes the dislocation density.</subfield>
  </datafield>
  <datafield tag="540" ind1=" " ind2=" ">
   <subfield code="a">TMS, 2013</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">Relaxation</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">dislocation compensation</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">linearly and ungraded buffers</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="690" ind1=" " ind2="7">
   <subfield code="a">compositional tolerance</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Kujofsa</subfield>
   <subfield code="D">T.</subfield>
   <subfield code="u">Electrical and Computer Engineering Department, University of Connecticut, 371 Fairfield Way, Unit 4157, 06269-4157, Storrs, CT, USA</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Ayers</subfield>
   <subfield code="D">J.E.</subfield>
   <subfield code="u">Electrical and Computer Engineering Department, University of Connecticut, 371 Fairfield Way, Unit 4157, 06269-4157, Storrs, CT, USA</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="773" ind1="0" ind2=" ">
   <subfield code="t">Journal of Electronic Materials</subfield>
   <subfield code="d">Springer US; http://www.springer-ny.com</subfield>
   <subfield code="g">42/11(2013-11-01), 3034-3040</subfield>
   <subfield code="x">0361-5235</subfield>
   <subfield code="q">42:11&lt;3034</subfield>
   <subfield code="1">2013</subfield>
   <subfield code="2">42</subfield>
   <subfield code="o">11664</subfield>
  </datafield>
  <datafield tag="856" ind1="4" ind2="0">
   <subfield code="u">https://doi.org/10.1007/s11664-013-2773-y</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="908" ind1=" " ind2=" ">
   <subfield code="D">1</subfield>
   <subfield code="a">research-article</subfield>
   <subfield code="2">jats</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">856</subfield>
   <subfield code="E">40</subfield>
   <subfield code="u">https://doi.org/10.1007/s11664-013-2773-y</subfield>
   <subfield code="q">text/html</subfield>
   <subfield code="z">Onlinezugriff via DOI</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Kujofsa</subfield>
   <subfield code="D">T.</subfield>
   <subfield code="u">Electrical and Computer Engineering Department, University of Connecticut, 371 Fairfield Way, Unit 4157, 06269-4157, Storrs, CT, USA</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">700</subfield>
   <subfield code="E">1-</subfield>
   <subfield code="a">Ayers</subfield>
   <subfield code="D">J.E.</subfield>
   <subfield code="u">Electrical and Computer Engineering Department, University of Connecticut, 371 Fairfield Way, Unit 4157, 06269-4157, Storrs, CT, USA</subfield>
   <subfield code="4">aut</subfield>
  </datafield>
  <datafield tag="950" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="P">773</subfield>
   <subfield code="E">0-</subfield>
   <subfield code="t">Journal of Electronic Materials</subfield>
   <subfield code="d">Springer US; http://www.springer-ny.com</subfield>
   <subfield code="g">42/11(2013-11-01), 3034-3040</subfield>
   <subfield code="x">0361-5235</subfield>
   <subfield code="q">42:11&lt;3034</subfield>
   <subfield code="1">2013</subfield>
   <subfield code="2">42</subfield>
   <subfield code="o">11664</subfield>
  </datafield>
  <datafield tag="900" ind1=" " ind2="7">
   <subfield code="a">Metadata rights reserved</subfield>
   <subfield code="b">Springer special CC-BY-NC licence</subfield>
   <subfield code="2">nationallicence</subfield>
  </datafield>
  <datafield tag="898" ind1=" " ind2=" ">
   <subfield code="a">BK010053</subfield>
   <subfield code="b">XK010053</subfield>
   <subfield code="c">XK010000</subfield>
  </datafield>
  <datafield tag="949" ind1=" " ind2=" ">
   <subfield code="B">NATIONALLICENCE</subfield>
   <subfield code="F">NATIONALLICENCE</subfield>
   <subfield code="b">NL-springer</subfield>
  </datafield>
 </record>
</collection>
