naa a22 4500 510821839 CHVBK 20180411083536.0 cr unu---uuuuu 180411e20130101xx s 000 0 eng 10.1007/s12541-013-0002-5 doi (NATIONALLICENCE)springer-10.1007/s12541-013-0002-5 Planarization of wafer edge profile in chemical mechanical polishing [Elektronische Daten] [Yeongbong Park, Hobin Jeong, Sungha Choi, Haedo Jeong] Within wafer non-uniformity (WIWNU), which significantly affects the yield of chip products, is mainly caused by non-uniform chemical mechanical polishing (CMP) at the wafer's edge. This study investigates the origins of the non-uniformity and presents a process that uses an edge profile control ring (EPC ring) to solve the problem. The EPC ring is designed to be positioned between the wafer and the retaining ring and pressed at the same pressure as the wafer by a flexible membrane to reduce the pressure discontinuity between the center region and the edge region of the wafer. Experimental results show that for a WIWNU of 2%, the EPC ring makes it possible to shrink the edge exclusion region from 15 mm to 2 mm without any change in process conditions. This result suggests that the EPC ring is applicable to real fabrication. Korean Society for Precision Engineering and Springer-Verlag Berlin Heidelberg, 2013 Wafer Edge nationallicence Chemical Mechanical Polishing nationallicence Edge Profile Control Ring nationallicence D : bending stiffness of the top pad nationallicence E : Young's modulus of the top pad nationallicence h : thickness of the top pad nationallicence ν : Poisson's ratio of the top pad nationallicence k : spring constant of the sub pad nationallicence c : slope of the compressibility(percent/pressure) nationallicence t : thickness of the sub pad nationallicence Park Yeongbong Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut Jeong Hobin Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut Choi Sungha Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut Jeong Haedo Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut International Journal of Precision Engineering and Manufacturing Korean Society for Precision Engineering 14/1(2013-01-01), 11-15 2234-7593 14:1<11 2013 14 12541 https://doi.org/10.1007/s12541-013-0002-5 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s12541-013-0002-5 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Park Yeongbong Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut NATIONALLICENCE 700 1- Jeong Hobin Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut NATIONALLICENCE 700 1- Choi Sungha Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut NATIONALLICENCE 700 1- Jeong Haedo Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut NATIONALLICENCE 773 0- International Journal of Precision Engineering and Manufacturing Korean Society for Precision Engineering 14/1(2013-01-01), 11-15 2234-7593 14:1<11 2013 14 12541 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer