naa a22 4500 510822584 CHVBK 20180411083540.0 cr unu---uuuuu 180411e20130901xx s 000 0 eng 10.1007/s12541-013-0204-x doi (NATIONALLICENCE)springer-10.1007/s12541-013-0204-x Effect of contact angle between retaining ring and polishing pad on material removal uniformity in CMP process [Elektronische Daten] [Yeongbong Park, Hyunseop Lee, Youngkyun Lee, Sunjoon Park, Haedo Jeong] This paper presents the effect of the contact angle between the retaining ring and the polishing pad in chemical mechanical polishing (CMP) on the profile of the material removal rate (MRR) around the wafer edge and on the within-wafer nonuniformity (WIWNU). This study demonstrates that the mechanical interaction among the polishing pad, wafer, and retaining ring influences the ability to achieve planarization from the CMP process. In particular, the purpose of this study is to understand the effect of the contact conditions between the retaining ring and the pad on the CMP process. In order to verify the mechanical aspects of the MRR near the wafer edge, retaining rings with different contact angles were prepared. Finite element analysis (FEA) verified the effect of the contact angle between the retaining ring and the polishing pad on the stress distribution around the edge of the wafer. The results of the analysis were corroborated by conducting CMP experiments with 200-mm blanket oxide wafers. As expected, the FEA results were in good agreement with the MRR profile around the edge area. Through simulations and experiments, we concluded that the contact angle is an important factor to achieve a flatter edge profile and the material removal profile around the edge of the wafer was optimum at a 0o contact angle. In particular the WIWNU was below 4% when a flat retaining ring was used. The results of this study make it possible to improve the yield of chip production by ensuring the retaining ring maintains perfect flatness without making any special design changes to the CMP equipment. Korean Society for Precision Engineering and Springer-Verlag Berlin Heidelberg, 2013 CMP nationallicence Edge exclusion nationallicence Edge effect nationallicence Retaining ring nationallicence Contact angle nationallicence Finite element analysis nationallicence Park Yeongbong Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut Lee Hyunseop Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut Lee Youngkyun Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut Park Sunjoon Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut Jeong Haedo Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut International Journal of Precision Engineering and Manufacturing Springer Berlin Heidelberg 14/9(2013-09-01), 1513-1518 2234-7593 14:9<1513 2013 14 12541 https://doi.org/10.1007/s12541-013-0204-x text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s12541-013-0204-x text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Park Yeongbong Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut NATIONALLICENCE 700 1- Lee Hyunseop Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut NATIONALLICENCE 700 1- Lee Youngkyun Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut NATIONALLICENCE 700 1- Park Sunjoon Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut NATIONALLICENCE 700 1- Jeong Haedo Graduate School of Mechanical Engineering, Pusan National University, Jangjeon-dong, Gumjung-gu, 609-735, Busan, South Korea aut NATIONALLICENCE 773 0- International Journal of Precision Engineering and Manufacturing Springer Berlin Heidelberg 14/9(2013-09-01), 1513-1518 2234-7593 14:9<1513 2013 14 12541 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer