naa a22 4500 510823971 CHVBK 20180411083547.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s12541-013-0195-7 doi (NATIONALLICENCE)springer-10.1007/s12541-013-0195-7 Effects of chemical slurries on fixed abrasive chemical-mechanical polishing of optical silicon substrates [Elektronische Daten] [Yebing Tian, Zhaowei Zhong, Jun Ng] Chemical mechanical polishing (CMP) with fixed abrasive pad is an alternative machining method to loose abrasive lapping and partial polishing with traditional pad in the fabrication of optical silicon substrates. However, the effects of chemical slurry on the fixed abrasive polishing performance are not fully understood. In this work, a serial of CMP experiments with a fixed abrasive pad were carried out for optical silicon substrates using seven different chemical slurries i.e. de-ionized water, alkaline lubricant, colloidal silica, hydrogen peroxide (H2O2) and potassium hydroxide (KOH). The polishing performances of these slurries were evaluated and compared in terms of material removal rate (MRR), surface roughness and flatness of the polished silicon substrates. The polishing characteristics were also discussed to reveal material removal mechanism and silicon surface generation under different chemical environments. Korean Society for Precision Engineering and Springer-Verlag Berlin Heidelberg, 2013 Chemical-mechanical polishing nationallicence Fixed abrasive pad nationallicence Surface roughness nationallicence Material removal rate nationallicence m i : mass before polishing nationallicence m f : mass after polishing nationallicence ρ : density of workpieces nationallicence A : area of the substrate polished nationallicence t : polishing time nationallicence φ : average abrasive diameter nationallicence p : applied pressure nationallicence k : concentration of abrasive nationallicence E : Young's modulus of workpiece nationallicence Tian Yebing Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut Zhong Zhaowei School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore aut Ng Jun School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore aut International Journal of Precision Engineering and Manufacturing Springer Berlin Heidelberg 14/8(2013-08-01), 1447-1454 2234-7593 14:8<1447 2013 14 12541 https://doi.org/10.1007/s12541-013-0195-7 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s12541-013-0195-7 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Tian Yebing Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut NATIONALLICENCE 700 1- Zhong Zhaowei School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore aut NATIONALLICENCE 700 1- Ng Jun School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore aut NATIONALLICENCE 773 0- International Journal of Precision Engineering and Manufacturing Springer Berlin Heidelberg 14/8(2013-08-01), 1447-1454 2234-7593 14:8<1447 2013 14 12541 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer