Robust design of microelectronics assemblies against mechanical schock, temperature and moisture
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| 005 | 20201014122246.0 | ||
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| 008 | 150123t20152015mauad sb 001 0 eng|d | ||
| 020 | |a 978-1-84569-528-6 | ||
| 020 | |a 978-0-85709-911-2 (ebook) | ||
| 035 | |a (SERSOL)ssj0001548973 | ||
| 035 | |a (WaSeSS)ssj0001548973 | ||
| 040 | |a CaPaEBR |b eng |c CaPaEBR |d WaSeSS |e rda | ||
| 050 | 1 | 4 | |a TK7874 |b .W66 2015eb |
| 082 | 0 | 4 | |a 621.381046 |2 23 |
| 100 | 1 | |a Wong |D E- H. |e author | |
| 245 | 1 | 0 | |a Robust design of microelectronics assemblies against mechanical schock, temperature and moisture |c E-H Wong, Y.-W Mai |
| 264 | 1 | |a Boston, MA |b Elsevier |c [2015] | |
| 264 | 4 | |c ©2015 | |
| 300 | |a 1 online resource (477 pages) |b illustrations (some color) | ||
| 336 | |a text |b txt |2 rdacontent/eng | ||
| 337 | |a computer |b c |2 rdamedia/eng | ||
| 338 | |a online resource |b cr |2 rdacarrier/eng | ||
| 490 | 0 | |a Woodhead Publishing series in electronic and optical materials |x 2050-1501 |v number 81 | |
| 504 | |a Includes bibliographical references and index. | ||
| 506 | |a Lizenzbedingungen können den Zugang einschränken. License restrictions may limit access. | ||
| 588 | |a Description based on print version record. | ||
| 650 | 0 | |a Microelectronics |x Design | |
| 650 | 0 | |a Industrial design | |
| 650 | 0 | |a Robust control | |
| 700 | 1 | |a Mai |D Y.-W |e author | |
| 776 | 0 | 8 | |i Print version |a Wong, E- H. |t Robust design of microelectronics assemblies against mechanical schock, temperature and moisture. |x 2050-1501 |z 9781845695286 |7 (DLC)18461254 |
| 856 | 4 | 0 | |u https://ebookcentral.proquest.com/lib/unibern/detail.action?docID=2056911 |z Uni Bern: Volltext |
| 898 | |a BK020053 |b XK020053 |c XK020000 | ||
| 909 | 4 | |f Ebook Central All Subscribed Titles | |
| 909 | 4 | |a E-Books von 360MarcUpdates | |
| 949 | |B IDSBB |F B405 |b B405 |c 405VT |x NELB4051809 | ||
| 950 | |B IDSBB |P 100 |E 1- |a Wong |D E- H. |e author | ||
| 950 | |B IDSBB |P 490 |E 1- |a Woodhead Publishing series in electronic and optical materials |x 2050-1501 |v number 81 | ||
| 950 | |B IDSBB |P 700 |E 1- |a Mai |D Y.-W |e author | ||
| 950 | |B IDSBB |P 776 |E 08 |a Wong, E- H |i Print version |t Robust design of microelectronics assemblies against mechanical schock, temperature and moisture |x 2050-1501 |z 9781845695286 |7 (DLC)18461254 | ||
| 950 | |B IDSBB |P 856 |E 40 |u https://ebookcentral.proquest.com/lib/unibern/detail.action?docID=2056911 |z Uni Bern: Volltext | ||
| 986 | |a SWISSBIB |b 341781665 | ||