Simple and low cost integration of highly conductive three-dimensional electrodes in microfluidic devices

Verfasser / Beitragende:
[Srinivasu Puttaswamy, Peng Xue, Yuejun Kang, Ye Ai]
Ort, Verlag, Jahr:
2015
Enthalten in:
Biomedical Microdevices, 17/1(2015-02-01), 1-5
Format:
Artikel (online)
ID: 605479356
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024 7 0 |a 10.1007/s10544-014-9913-x  |2 doi 
035 |a (NATIONALLICENCE)springer-10.1007/s10544-014-9913-x 
245 0 0 |a Simple and low cost integration of highly conductive three-dimensional electrodes in microfluidic devices  |h [Elektronische Daten]  |c [Srinivasu Puttaswamy, Peng Xue, Yuejun Kang, Ye Ai] 
520 3 |a This work presents a fast, simple, and cost-effective technique for fabricating and integrating highly conductive 3D microelectrodes into microfluidic devices. The 3D electrodes are made of low cost, commercially available conductive adhesive and carbon powder. The device can be fabricated by a single-step soft lithography and controllable injections of a conductive composite into microchannels. Functioning of the microfluidic device with 3D electrodes was demonstrated through DEP particle switching as an example for a wide range of microfluidic applications. 
540 |a Springer Science+Business Media New York, 2015 
690 7 |a Microfluidics  |2 nationallicence 
690 7 |a Low-cost fabrication  |2 nationallicence 
690 7 |a 3D Microelectrodes  |2 nationallicence 
690 7 |a Dielectrophoresis  |2 nationallicence 
690 7 |a Particle manipulation  |2 nationallicence 
700 1 |a Puttaswamy  |D Srinivasu  |u Pillar of Engineering Product Development, Singapore University of Technology and Design, 138682, Singapore, Singapore  |4 aut 
700 1 |a Xue  |D Peng  |u School of Chemical and Biomedical Engineering, Nanyang Technological University, 637459, Singapore, Singapore  |4 aut 
700 1 |a Kang  |D Yuejun  |u School of Chemical and Biomedical Engineering, Nanyang Technological University, 637459, Singapore, Singapore  |4 aut 
700 1 |a Ai  |D Ye  |u Pillar of Engineering Product Development, Singapore University of Technology and Design, 138682, Singapore, Singapore  |4 aut 
773 0 |t Biomedical Microdevices  |d Springer US; http://www.springer-ny.com  |g 17/1(2015-02-01), 1-5  |x 1387-2176  |q 17:1<1  |1 2015  |2 17  |o 10544 
856 4 0 |u https://doi.org/10.1007/s10544-014-9913-x  |q text/html  |z Onlinezugriff via DOI 
898 |a BK010053  |b XK010053  |c XK010000 
900 7 |a Metadata rights reserved  |b Springer special CC-BY-NC licence  |2 nationallicence 
908 |D 1  |a research-article  |2 jats 
949 |B NATIONALLICENCE  |F NATIONALLICENCE  |b NL-springer 
950 |B NATIONALLICENCE  |P 856  |E 40  |u https://doi.org/10.1007/s10544-014-9913-x  |q text/html  |z Onlinezugriff via DOI 
950 |B NATIONALLICENCE  |P 700  |E 1-  |a Puttaswamy  |D Srinivasu  |u Pillar of Engineering Product Development, Singapore University of Technology and Design, 138682, Singapore, Singapore  |4 aut 
950 |B NATIONALLICENCE  |P 700  |E 1-  |a Xue  |D Peng  |u School of Chemical and Biomedical Engineering, Nanyang Technological University, 637459, Singapore, Singapore  |4 aut 
950 |B NATIONALLICENCE  |P 700  |E 1-  |a Kang  |D Yuejun  |u School of Chemical and Biomedical Engineering, Nanyang Technological University, 637459, Singapore, Singapore  |4 aut 
950 |B NATIONALLICENCE  |P 700  |E 1-  |a Ai  |D Ye  |u Pillar of Engineering Product Development, Singapore University of Technology and Design, 138682, Singapore, Singapore  |4 aut 
950 |B NATIONALLICENCE  |P 773  |E 0-  |t Biomedical Microdevices  |d Springer US; http://www.springer-ny.com  |g 17/1(2015-02-01), 1-5  |x 1387-2176  |q 17:1<1  |1 2015  |2 17  |o 10544