A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications
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| 003 | CHVBK | ||
| 005 | 20210128100410.0 | ||
| 007 | cr unu---uuuuu | ||
| 008 | 210128e20150201xx s 000 0 eng | ||
| 024 | 7 | 0 | |a 10.1007/s10544-014-9906-9 |2 doi |
| 035 | |a (NATIONALLICENCE)springer-10.1007/s10544-014-9906-9 | ||
| 245 | 0 | 2 | |a A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications |h [Elektronische Daten] |c [Chih-Wei Chang, Lei-Chun Chou, Po-Tsang Huang, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Jin-Chern Chiou] |
| 520 | 3 | |a We present a new double-sided, single-chip monolithic integration scheme to integrate the CMOS circuits and MEMS structures by using through-silicon-via (TSV). Neural sensing applications were chosen as the implementation example. The proposed heterogeneous device integrates standard 0.18μm CMOS technology, TSV and neural probe array into a compact single chip device. The neural probe array on the back-side of the chip is connected to the CMOS circuits on the front-side of the chip by using low-parasitic TSVs through the chip. Successful fabrication results and detailed characterization demonstrate the feasibility and performance of the neural probe array, TSV and readout circuitry. The fabricated device is 5 × 5mm2 in area, with 16 channels of 150μm-in-length neural probe array on the back-side, 200μm-deep TSV through the chip and CMOS circuits on the front-side. Each channel consists of a 5 × 6 probe array, 3 × 14 TSV array and a differential-difference amplifier (DDA) based analog front-end circuitry with 1.8V supply, 21.88μW power consumption, 108dB CMRR and 2.56 μVrms input referred noise. In-vivo long term implantation demonstrated the feasibility of presented integration scheme after 7 and 58days of implantation. We expect the conceptual realization can be extended for higher density recording array by using the proposed method. | |
| 540 | |a Springer Science+Business Media New York, 2015 | ||
| 690 | 7 | |a Through silicon via |2 nationallicence | |
| 690 | 7 | |a CMOS technology |2 nationallicence | |
| 690 | 7 | |a Neural probe array |2 nationallicence | |
| 690 | 7 | |a Electrode |2 nationallicence | |
| 690 | 7 | |a Heterogeneous integration |2 nationallicence | |
| 700 | 1 | |a Chang |D Chih-Wei |u Department of Bioengineering, University of California in Los Angeles, 90095, Los Angeles, CA, USA |4 aut | |
| 700 | 1 | |a Chou |D Lei-Chun |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | |
| 700 | 1 | |a Huang |D Po-Tsang |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | |
| 700 | 1 | |a Wu |D Shang-Lin |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | |
| 700 | 1 | |a Lee |D Shih-Wei |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | |
| 700 | 1 | |a Chuang |D Ching-Te |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | |
| 700 | 1 | |a Chen |D Kuan-Neng |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | |
| 700 | 1 | |a Hwang |D Wei |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | |
| 700 | 1 | |a Chen |D Kuo-Hua |u Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan |4 aut | |
| 700 | 1 | |a Chiu |D Chi-Tsung |u Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan |4 aut | |
| 700 | 1 | |a Tong |D Ho-Ming |u Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan |4 aut | |
| 700 | 1 | |a Chiou |D Jin-Chern |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | |
| 773 | 0 | |t Biomedical Microdevices |d Springer US; http://www.springer-ny.com |g 17/1(2015-02-01), 1-15 |x 1387-2176 |q 17:1<1 |1 2015 |2 17 |o 10544 | |
| 856 | 4 | 0 | |u https://doi.org/10.1007/s10544-014-9906-9 |q text/html |z Onlinezugriff via DOI |
| 898 | |a BK010053 |b XK010053 |c XK010000 | ||
| 900 | 7 | |a Metadata rights reserved |b Springer special CC-BY-NC licence |2 nationallicence | |
| 908 | |D 1 |a research-article |2 jats | ||
| 949 | |B NATIONALLICENCE |F NATIONALLICENCE |b NL-springer | ||
| 950 | |B NATIONALLICENCE |P 856 |E 40 |u https://doi.org/10.1007/s10544-014-9906-9 |q text/html |z Onlinezugriff via DOI | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Chang |D Chih-Wei |u Department of Bioengineering, University of California in Los Angeles, 90095, Los Angeles, CA, USA |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Chou |D Lei-Chun |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Huang |D Po-Tsang |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Wu |D Shang-Lin |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Lee |D Shih-Wei |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Chuang |D Ching-Te |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Chen |D Kuan-Neng |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Hwang |D Wei |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Chen |D Kuo-Hua |u Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Chiu |D Chi-Tsung |u Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Tong |D Ho-Ming |u Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Chiou |D Jin-Chern |u National Chiao Tung University, 30010, Hsinchu, Taiwan |4 aut | ||
| 950 | |B NATIONALLICENCE |P 773 |E 0- |t Biomedical Microdevices |d Springer US; http://www.springer-ny.com |g 17/1(2015-02-01), 1-15 |x 1387-2176 |q 17:1<1 |1 2015 |2 17 |o 10544 | ||