caa a22 4500 605479399 CHVBK 20210128100410.0 cr unu---uuuuu 210128e20150201xx s 000 0 eng 10.1007/s10544-014-9906-9 doi (NATIONALLICENCE)springer-10.1007/s10544-014-9906-9 A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications [Elektronische Daten] [Chih-Wei Chang, Lei-Chun Chou, Po-Tsang Huang, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Jin-Chern Chiou] We present a new double-sided, single-chip monolithic integration scheme to integrate the CMOS circuits and MEMS structures by using through-silicon-via (TSV). Neural sensing applications were chosen as the implementation example. The proposed heterogeneous device integrates standard 0.18μm CMOS technology, TSV and neural probe array into a compact single chip device. The neural probe array on the back-side of the chip is connected to the CMOS circuits on the front-side of the chip by using low-parasitic TSVs through the chip. Successful fabrication results and detailed characterization demonstrate the feasibility and performance of the neural probe array, TSV and readout circuitry. The fabricated device is 5 × 5mm2 in area, with 16 channels of 150μm-in-length neural probe array on the back-side, 200μm-deep TSV through the chip and CMOS circuits on the front-side. Each channel consists of a 5 × 6 probe array, 3 × 14 TSV array and a differential-difference amplifier (DDA) based analog front-end circuitry with 1.8V supply, 21.88μW power consumption, 108dB CMRR and 2.56 μVrms input referred noise. In-vivo long term implantation demonstrated the feasibility of presented integration scheme after 7 and 58days of implantation. We expect the conceptual realization can be extended for higher density recording array by using the proposed method. Springer Science+Business Media New York, 2015 Through silicon via nationallicence CMOS technology nationallicence Neural probe array nationallicence Electrode nationallicence Heterogeneous integration nationallicence Chang Chih-Wei Department of Bioengineering, University of California in Los Angeles, 90095, Los Angeles, CA, USA aut Chou Lei-Chun National Chiao Tung University, 30010, Hsinchu, Taiwan aut Huang Po-Tsang National Chiao Tung University, 30010, Hsinchu, Taiwan aut Wu Shang-Lin National Chiao Tung University, 30010, Hsinchu, Taiwan aut Lee Shih-Wei National Chiao Tung University, 30010, Hsinchu, Taiwan aut Chuang Ching-Te National Chiao Tung University, 30010, Hsinchu, Taiwan aut Chen Kuan-Neng National Chiao Tung University, 30010, Hsinchu, Taiwan aut Hwang Wei National Chiao Tung University, 30010, Hsinchu, Taiwan aut Chen Kuo-Hua Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan aut Chiu Chi-Tsung Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan aut Tong Ho-Ming Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan aut Chiou Jin-Chern National Chiao Tung University, 30010, Hsinchu, Taiwan aut Biomedical Microdevices Springer US; http://www.springer-ny.com 17/1(2015-02-01), 1-15 1387-2176 17:1<1 2015 17 10544 https://doi.org/10.1007/s10544-014-9906-9 text/html Onlinezugriff via DOI BK010053 XK010053 XK010000 Metadata rights reserved Springer special CC-BY-NC licence nationallicence 1 research-article jats NATIONALLICENCE NATIONALLICENCE NL-springer NATIONALLICENCE 856 40 https://doi.org/10.1007/s10544-014-9906-9 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Chang Chih-Wei Department of Bioengineering, University of California in Los Angeles, 90095, Los Angeles, CA, USA aut NATIONALLICENCE 700 1- Chou Lei-Chun National Chiao Tung University, 30010, Hsinchu, Taiwan aut NATIONALLICENCE 700 1- Huang Po-Tsang National Chiao Tung University, 30010, Hsinchu, Taiwan aut NATIONALLICENCE 700 1- Wu Shang-Lin National Chiao Tung University, 30010, Hsinchu, Taiwan aut NATIONALLICENCE 700 1- Lee Shih-Wei National Chiao Tung University, 30010, Hsinchu, Taiwan aut NATIONALLICENCE 700 1- Chuang Ching-Te National Chiao Tung University, 30010, Hsinchu, Taiwan aut NATIONALLICENCE 700 1- Chen Kuan-Neng National Chiao Tung University, 30010, Hsinchu, Taiwan aut NATIONALLICENCE 700 1- Hwang Wei National Chiao Tung University, 30010, Hsinchu, Taiwan aut NATIONALLICENCE 700 1- Chen Kuo-Hua Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan aut NATIONALLICENCE 700 1- Chiu Chi-Tsung Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan aut NATIONALLICENCE 700 1- Tong Ho-Ming Advanced Semiconductor Engineering Group, 81170, Kaohsiung, Taiwan aut NATIONALLICENCE 700 1- Chiou Jin-Chern National Chiao Tung University, 30010, Hsinchu, Taiwan aut NATIONALLICENCE 773 0- Biomedical Microdevices Springer US; http://www.springer-ny.com 17/1(2015-02-01), 1-15 1387-2176 17:1<1 2015 17 10544