Wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible biomedical platform
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| 024 | 7 | 0 | |a 10.1007/s10544-015-9930-4 |2 doi |
| 035 | |a (NATIONALLICENCE)springer-10.1007/s10544-015-9930-4 | ||
| 245 | 0 | 0 | |a Wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible biomedical platform |h [Elektronische Daten] |c [Jimin Maeng, Chuizhou Meng, Pedro Irazoqui] |
| 520 | 3 | |a We present wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible parylene platform, as progress toward sustainably powering biomedical microsystems suitable for implantable and wearable applications. All-solid-state, low-profile (<30μm), and high-density (up to ~500μF/mm2) micro-supercapacitors are formed on an ultrathin (~20μm) freestanding parylene film by a wafer-scale parylene packaging process in combination with a polyaniline (PANI) nanowire growth technique assisted by surface plasma treatment. These micro-supercapacitors are highly flexible and shown to be resilient toward flexural stress. Further, direct integration of micro-supercapacitors into a radio frequency (RF) rectifying circuit is achieved on a single parylene platform, yielding a complete RF energy harvesting microsystem. The system discharging rate is shown to improve by ~17 times in the presence of the integrated micro-supercapacitors. This result suggests that the integrated micro-supercapacitor technology described herein is a promising strategy for sustainably powering biomedical microsystems dedicated to implantable and wearable applications. | |
| 540 | |a Springer Science+Business Media New York, 2015 | ||
| 690 | 7 | |a Energy storage |2 nationallicence | |
| 690 | 7 | |a Flexible |2 nationallicence | |
| 690 | 7 | |a Implantable devices |2 nationallicence | |
| 690 | 7 | |a Micro-supercapacitors |2 nationallicence | |
| 690 | 7 | |a Wafer-scale integration |2 nationallicence | |
| 700 | 1 | |a Maeng |D Jimin |u Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA |4 aut | |
| 700 | 1 | |a Meng |D Chuizhou |u Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA |4 aut | |
| 700 | 1 | |a Irazoqui |D Pedro |u Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA |4 aut | |
| 773 | 0 | |t Biomedical Microdevices |d Springer US; http://www.springer-ny.com |g 17/1(2015-02-01), 1-10 |x 1387-2176 |q 17:1<1 |1 2015 |2 17 |o 10544 | |
| 856 | 4 | 0 | |u https://doi.org/10.1007/s10544-015-9930-4 |q text/html |z Onlinezugriff via DOI |
| 898 | |a BK010053 |b XK010053 |c XK010000 | ||
| 900 | 7 | |a Metadata rights reserved |b Springer special CC-BY-NC licence |2 nationallicence | |
| 908 | |D 1 |a research-article |2 jats | ||
| 949 | |B NATIONALLICENCE |F NATIONALLICENCE |b NL-springer | ||
| 950 | |B NATIONALLICENCE |P 856 |E 40 |u https://doi.org/10.1007/s10544-015-9930-4 |q text/html |z Onlinezugriff via DOI | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Maeng |D Jimin |u Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Meng |D Chuizhou |u Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA |4 aut | ||
| 950 | |B NATIONALLICENCE |P 700 |E 1- |a Irazoqui |D Pedro |u Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA |4 aut | ||
| 950 | |B NATIONALLICENCE |P 773 |E 0- |t Biomedical Microdevices |d Springer US; http://www.springer-ny.com |g 17/1(2015-02-01), 1-10 |x 1387-2176 |q 17:1<1 |1 2015 |2 17 |o 10544 | ||