caa a22 4500 605479437 CHVBK 20210128100410.0 cr unu---uuuuu 210128e20150201xx s 000 0 eng 10.1007/s10544-015-9930-4 doi (NATIONALLICENCE)springer-10.1007/s10544-015-9930-4 Wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible biomedical platform [Elektronische Daten] [Jimin Maeng, Chuizhou Meng, Pedro Irazoqui] We present wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible parylene platform, as progress toward sustainably powering biomedical microsystems suitable for implantable and wearable applications. All-solid-state, low-profile (<30μm), and high-density (up to ~500μF/mm2) micro-supercapacitors are formed on an ultrathin (~20μm) freestanding parylene film by a wafer-scale parylene packaging process in combination with a polyaniline (PANI) nanowire growth technique assisted by surface plasma treatment. These micro-supercapacitors are highly flexible and shown to be resilient toward flexural stress. Further, direct integration of micro-supercapacitors into a radio frequency (RF) rectifying circuit is achieved on a single parylene platform, yielding a complete RF energy harvesting microsystem. The system discharging rate is shown to improve by ~17 times in the presence of the integrated micro-supercapacitors. This result suggests that the integrated micro-supercapacitor technology described herein is a promising strategy for sustainably powering biomedical microsystems dedicated to implantable and wearable applications. Springer Science+Business Media New York, 2015 Energy storage nationallicence Flexible nationallicence Implantable devices nationallicence Micro-supercapacitors nationallicence Wafer-scale integration nationallicence Maeng Jimin Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA aut Meng Chuizhou Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA aut Irazoqui Pedro Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA aut Biomedical Microdevices Springer US; http://www.springer-ny.com 17/1(2015-02-01), 1-10 1387-2176 17:1<1 2015 17 10544 https://doi.org/10.1007/s10544-015-9930-4 text/html Onlinezugriff via DOI BK010053 XK010053 XK010000 Metadata rights reserved Springer special CC-BY-NC licence nationallicence 1 research-article jats NATIONALLICENCE NATIONALLICENCE NL-springer NATIONALLICENCE 856 40 https://doi.org/10.1007/s10544-015-9930-4 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Maeng Jimin Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA aut NATIONALLICENCE 700 1- Meng Chuizhou Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA aut NATIONALLICENCE 700 1- Irazoqui Pedro Center for Implantable Devices, Weldon School of Biomedical Engineering, Purdue University, 47907, West Lafayette, IN, USA aut NATIONALLICENCE 773 0- Biomedical Microdevices Springer US; http://www.springer-ny.com 17/1(2015-02-01), 1-10 1387-2176 17:1<1 2015 17 10544