caa a22 4500 606195394 CHVBK 20210128100919.0 cr unu---uuuuu 210128e20150601xx s 000 0 eng 10.1007/s10934-015-9930-z doi (NATIONALLICENCE)springer-10.1007/s10934-015-9930-z Purushothaman Revathi B.S.Abdur Rahman University, G.S.T. Road, Vandalur, 600 048, Chennai, India aut Amine functionalized SBA-15/terpolyimide composites with low dielectric constant [Elektronische Daten] [Revathi Purushothaman] Polyimides with low dielectric constants are important raw materials for the fabrication of flexible printed circuit boards and other microelectronic applications. As creation of voids in polyimide matrix could decrease the dielectric constant, in this study mesoporous SBA-15, synthesized hydrothermally, was functionalized with 3-aminopropyltriethoxysilane (APTS) and incorporated (2-10%) into terpolyimide. The APTS functionalized SBA-15 was mixed with 4,4′-oxydianiline in the synthesis of terpoly(amic acid) using 3,3′,4,4′-biphenyldianhydride (BPDA), 3,3′,4,4′-oxydiphthalicdianhydride (ODPA) and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and subsequently stage-cured to obtain APTS-SBA-15/terpolyimide composites. The asymmetric and symmetric vibrations of imide O=C-N-C=O groups of APTS-SBA-15/terpolyimide composites showed their peaks at 1772 and 1713cm−1. The dielectric constant of APTS-SBA-15/terpolyimide composite decreased with the increase in APTS-SBA-15 loading from 2 to 8%, and remained same at 10%, and at 8 and 10% loading it was 2.42. However, there was agglomeration of mesoporous silica in APTS-SBA-15 (8 and 10%)/terpolyimide composites. Hence, APTS-SBA-15 (6%)/terpolyimide with dielectric constant (2.51), tensile strength (100MPa), tensile modulus (3.3GPa), percentage elongation (7.3) and high thermal stability (>540°C) could be suitable for application in microelectronics such as tape automated bonding and flexible printed circuits. Therefore, polyimide composites carrying optimum amount of mesoporous materials can be expected to have adequate thermal and mechanical properties with significantly low dielectric constant. Springer Science+Business Media New York, 2015 SBA-15 nationallicence Composites nationallicence Terpolyimide nationallicence Porous materials nationallicence Dielectric constant nationallicence Journal of Porous Materials Springer US; http://www.springer-ny.com 22/3(2015-06-01), 585-594 1380-2224 22:3<585 2015 22 10934 https://doi.org/10.1007/s10934-015-9930-z text/html Onlinezugriff via DOI BK010053 XK010053 XK010000 Metadata rights reserved Springer special CC-BY-NC licence nationallicence 1 research-article jats NATIONALLICENCE NATIONALLICENCE NL-springer NATIONALLICENCE 856 40 https://doi.org/10.1007/s10934-015-9930-z text/html Onlinezugriff via DOI NATIONALLICENCE 100 1- Purushothaman Revathi B.S.Abdur Rahman University, G.S.T. Road, Vandalur, 600 048, Chennai, India aut NATIONALLICENCE 773 0- Journal of Porous Materials Springer US; http://www.springer-ny.com 22/3(2015-06-01), 585-594 1380-2224 22:3<585 2015 22 10934