Molecular dynamics study on the tensile deformation of cross-linking epoxy resin

Verfasser / Beitragende:
[Dong Xin, Qiang Han]
Ort, Verlag, Jahr:
2015
Enthalten in:
Journal of Molecular Modeling, 21/1(2015-01-01), 1-6
Format:
Artikel (online)
ID: 60551075X
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024 7 0 |a 10.1007/s00894-014-2567-z  |2 doi 
035 |a (NATIONALLICENCE)springer-10.1007/s00894-014-2567-z 
245 0 0 |a Molecular dynamics study on the tensile deformation of cross-linking epoxy resin  |h [Elektronische Daten]  |c [Dong Xin, Qiang Han] 
520 3 |a Various epoxy resins are used in the electronic industry as encapsulants, adhesive, printed wiring boards, electronic packagings, and so on. In this study, molecular dynamics method is employed to simulate the tensile deformation of the typical electronic epoxy resin. An efficient cross-linking procedure is developed to build the molecular model. Based on the cross-linking algorithm, the effects of moisture content, cross-linking conversion, strain rate, and temperature on the mechanical properties of epoxy resins are investigated. The stress-strain curves are plotted. Also the Young's modulus and Poisson ratio are calculated. The simulation results are compared with existing experimental data. Good agreements are observed. The results show that mechanical properties of epoxy resin decrease obviously with increasing moisture content and temperature. However the high cross-linking conversion and strain rate enhance the mechanical properties of resin. This study is significant to understanding the mechanical properties of cross-linking epoxies in high temperature and high humidity. 
540 |a Springer-Verlag Berlin Heidelberg, 2015 
690 7 |a Cross-linking algorithm  |2 nationallicence 
690 7 |a Epoxy resins  |2 nationallicence 
690 7 |a Molecular dynamics  |2 nationallicence 
690 7 |a Tensile deformation  |2 nationallicence 
700 1 |a Xin  |D Dong  |u College of Civil Engineering, Fujian University of Technology, 350118, Fuzhou, Fujian Province, People's Republic of China  |4 aut 
700 1 |a Han  |D Qiang  |u Department of Engineering Mechanics, School of Civil Engineering and Transportation, South China University of Technology, 510640, Guangzhou, Guangdong Province, People's Republic of China  |4 aut 
773 0 |t Journal of Molecular Modeling  |d Springer Berlin Heidelberg  |g 21/1(2015-01-01), 1-6  |x 1610-2940  |q 21:1<1  |1 2015  |2 21  |o 894 
856 4 0 |u https://doi.org/10.1007/s00894-014-2567-z  |q text/html  |z Onlinezugriff via DOI 
898 |a BK010053  |b XK010053  |c XK010000 
900 7 |a Metadata rights reserved  |b Springer special CC-BY-NC licence  |2 nationallicence 
908 |D 1  |a research-article  |2 jats 
949 |B NATIONALLICENCE  |F NATIONALLICENCE  |b NL-springer 
950 |B NATIONALLICENCE  |P 856  |E 40  |u https://doi.org/10.1007/s00894-014-2567-z  |q text/html  |z Onlinezugriff via DOI 
950 |B NATIONALLICENCE  |P 700  |E 1-  |a Xin  |D Dong  |u College of Civil Engineering, Fujian University of Technology, 350118, Fuzhou, Fujian Province, People's Republic of China  |4 aut 
950 |B NATIONALLICENCE  |P 700  |E 1-  |a Han  |D Qiang  |u Department of Engineering Mechanics, School of Civil Engineering and Transportation, South China University of Technology, 510640, Guangzhou, Guangdong Province, People's Republic of China  |4 aut 
950 |B NATIONALLICENCE  |P 773  |E 0-  |t Journal of Molecular Modeling  |d Springer Berlin Heidelberg  |g 21/1(2015-01-01), 1-6  |x 1610-2940  |q 21:1<1  |1 2015  |2 21  |o 894